JOB TITLE

PKG Development Engineer

(High Power Module)

Responsibilities

New Package development for High power Module.

-. Material modification & Package modification for Derivative Case Module development

-. New Intelligent Properties generation

-. Survey and Study for New package technology and trend

Qualifications

-. BS or MS in Material Science engineering / Metallurgy / Mechanical engineering

-. Over 5 years experience of package design in semiconductor industry

-. Preferential treatment for power module development experience

-. Key meterial (EMC, leadframe, Case and Heatsink) experience

-. Assembly process experience

-. Communication skills in English

ADDITIONAL INFO

* Status: Permanent
* Salary: Negotiation
제출서류영문 이력서 (MS-word file)

CONTACT POINT

* 담당자 – 노정하

* Email - nicole@kimcom.co.kr 

* Tel - 02)2183-1050

 

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