Process Quality Engineer



- To help support External Subcontractor Assembly activities with key topics including Package on Package (POP)/TMV, Fine Pitch Flip Chip, Stacked Die, Cu Pillar general process control (including SPC and Equipments).

- To Help resolve/manage technical issues regarding technical topics listed above.

Work across cross functional teams to help drive corrective actions/issue resolution

Knowledge/ Skill/ Experience

- Over 5 or 7 years experience in semiconductor packaging, quality and process area

- Package and Assembly Experience with a strong knowledge of the assembly process flow and details.

- Good technical problem solving skills

- Strong communication skills- English and Korean

- Strong Program Management Skills

- Candidate must be able to multi-task and handle many technical programs at once. Good program management skills required.

- Strong Skills Required

- Strong Interpersonal and Cross Functional Teaming Skills Required.

- Strong Program Tracking and Multi-tasking Skills Required

- Strong Support for New Strategic and Subcon Engagements


- BS/MS degree in Electronics or Semiconductor related field

- Communicate with all involved parties
  (mainly customer technical relationship)


* Work Location: KwangJu /Korea
       * Status: Permanent
       * Salary: Negotiation
제출서류영문 이력서 (MS-word file)


* 담당자정효진

* Email - 

* Tel - 02)574-2490 / 02)574-2479

주소: 서울 강남구 논현동 241-3 SK허브블루 1305

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