OMAP FAE (Hardware)

Main Responsibilities

- Integrate and implement Application Processor HW design in customer systems
Provide technical support and guidance to customers for Application Processor HW design
Test and debug technical issues in customer systems
- Communicate with marketing, application teams, R&D teams and customers for new program design-in




Ÿ  5+ years or more of HW development experience

Ÿ  Experiences and deep knowledge in designing schematic and PCB layout is required.

Ÿ  Experience in Digital circuit design is required.

Ÿ  Experience in memory interface is required. (NOR, NAND, OneNAND, SRAM, SDRAM, LPDDR2, etc)

Ÿ  Experience in various peripheral interfaces is required. (UART, I2C, SPI, PCM/I2S, etc)

Ÿ  Experiences in power consumption optimization is preferred

Ÿ  Experiences in Cellular/Smartphone system is preferred

Ÿ  Experiences in Circuit Simulation is preferred.

Ÿ  Experiences in Analog Circuit design is preferred

Ÿ  Experiences in BSP S/W is preferred

Ÿ  Effective and good communicator in both verbal and written forms, and in both Korean and English as well.

Ÿ  Team player


       *  Position:Team Member (Assistant manage(대리) ~ Sr. manager(차장))
       *  Status: Permanent
       *  Salary: Negotiation
       *  위치: 강남
       *  제출서류: 영문 이력서 (MS-word file)



        *   담당자 - 김호균

        *    Email -

        *   Tel  - 02) 574-2490/ 02)574-2479

        *    주소 : 서울 강남구 논현동 241-3 SK허브블루 1305호

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