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JOB TITLE |
Package Development Engineer |
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JOB DESCRIPTION |
-. New Package development for discrete, SPM and APM
-. Material modification & Package modification for Derivative
package development
-. New Intelligent Properties generation
-. Survey and Study for New package technology and trend
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REQUIRED KNOWLEDGE & SKILL |
'-. BS or MS in Material Science engineering / Metallurgy /
Mechanical engineering
-. Over 4 years experience of Packaging engineering in
semiconductor industry
-. Preferential treatment for Power module development
experience
-. Key meterial (EMC & leadframe) experience
-. Assembly process experience
-. Communication skills in English
-. Willingness to travel occasionally (mostly within Korea, but also to some
degree to China and USA)
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ADDITIONAL INFO |
• Position Level : 대리급
• Status: Permanent
• Salary: Nego
• 위치: 경기도
• 제출서류: 영문 이력서 & 영문자기소개서 (MS-word file)
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CONTACT POINT |
• 담당자 - 김의태
• Email daniel@kimcom.co.kr
• Tel 02) 574-2490 / 02) 574-2479
• 주소 : 서울 강남구 논현동 241-3 SK허브블루 1305호 |
